This year’s Mobile World Congress promised to take visitors to ‘the edge of innovation’, and we’re taking you into the action with highlights from the exhibition floor, keynote speakers and beyond.
Dublin: 04.03.2015 07.00AM
Apple is reportedly preparing for a third-quarter launch of the next iPhone after ordering key components from Taiwan for the device.
The Wall Street Journal reports that Apple is aiming to ship 25m units by the end of the year, according to suppliers. The initial production volume will be a few million units.
However, they warned shipments could be delayed if the component producers can’t improve their yield rate, due to how “complicated and difficult” the new iPhone is to assemble.
The next iPhone may be thinner and lighter than the iPhone 4 and may be equipped with an 8-megapixel camera.
It may operate on Qualcomm’s wireless baseband chips. The iPhone 4 used Infineon Technologies’ baseband chips with memory chips from Samsung.