Managing Director of Intel Labs Mike Mayberry and Dr Kieran Drain, CEO of Tyndall National Institute. Image via Pic Maxwell’s
Intel and the Tyndall National Institute have announced that they have renewed their partnership until 2018 to develop advanced electronics, with the former contributing $1.5m in funding.
Both Intel and Tyndall have been working on this common goal since 2009 and, having gone through two previous three-year phases, will see the Cork ICT research centre once again work directly with Intel’s components research group in Portland, Oregon.
More specifically, the pair will work together to investigate next-generation materials, devices and photonics technologies whereby Intel will hold the commercial exploitation licence to any advanced technology created through the collaboration.
Given that there has been six years of development achieved so far in the partnership, the pair has said in a joint statement that it anticipates building on the work of the first two phases of the programme to make an impact on the challenges of developing future electronic devices.
“Because of that breadth, it made sense for us to sponsor a large programme,” said Bernie Capraro, research manager of silicon technology at Intel Ireland.
“We appreciate Tyndall’s assistance in looking into the future of semiconductor technology and Moore’s Law, and their insights in evaluating potential future solutions.”
Future of Moore’s Law
Moore’s Law is of particular interest to those within the ICT research sector given claims earlier this year that the law – which in 1965 stated that the power of semiconductors and chips would double in capacity every year – is now being called redundant in the face of rapid technological development.
Also speaking of the deal, CEO of Tyndall, Dr Kieran Drain, said: “We have excellent scientists who have a creative approach to future challenges associated with the extension of Moore’s Law and Intel’s migration towards a focus on the internet of things (IoT).
“We are looking forward to continuing to work with Intel on major challenges, such as scaling, and examining new transistor architectures for high-density chips that can have a clear path to manufacturing with attractive economics.”
He concluded: “It requires new thought and a new approach to ensure that as chips get smaller and more power efficient, they also continue to get less expensive.”
